LEDs magazine reports that Lednium, an LED technology company based in Melbourne, Australia, has developed what is described as the world’s first three-dimensional LED platform for white, monocolor and mixed-color LED arrays.

Products include a multichip geodesic-dome-shaped 10W LED assembly that is available in white, blue, green, amber, red and other configurations such as RGB. The initial production of white devices yields 250 lm with a viewing angle of 120º .

The company recently signed an agreement with US-based Optek Technology to jointly develop and market a series of products using the 3D packaging technology (see “Lednium and Optek target solidstate lighting”, p16). Even more recently, Lednium signed a patent licensing agreement with Osram to license the German company’s

phosphor technology for manufacturing white LEDs.

The 3D products are assembled by mounting chips into cups, then the cups are placed into a dome-shaped lead frame. Lednium’s unique packaging technology is repeatable in mass production, and it can accept all chip architectures, which means that it can benefit from future advances in chip technology.

To view the full article go to www.ledsmagazine.com.