[LED EXPO 2015] OptoLEDs Introduces Next Generation LED with Flip Chip Technology
Name
Administrator
Date
2015.06.26
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624
OptoLEDs (CEO Kim Min-ji, www.optoleds.com) showcased a next generation LED, in which flip chip technology is applied to controllers, at the 13th International LED & OLED EXPO 2015 (LED EXPO 2015 for short), which will be held for four days from Tuesday the 23rd to Friday the 26th at KINTEX in Ilsan.
The company introduced the CSP, or Chip Scale Pakage. CSP is a next generation LED that has low thermal resistance with a flip chip and a phosphor coating.
It is stable and highly efficient compared to existing products. Also, it can come in smaller sizes. It can be applied to various fields, including facilities of 100W and 130W modules.
The company also showcased plant images that have various outside diameters, and are built with an AL die casting material.
Also, downlights, which are 3 to 10 inches, and TUBE LEDs, including a T8 short socket, a T8 long socket, and a T8 white 2P socket, were released.
The company is trying to cut production costs and diversify products of lighting housing by utilizing strict quality control and local subsidiary networks in China.
Furthermore, MLS, which has the largest LED PKG production level, is capable of customized CCT and Lm single rank supply. It maximizes efficiency with small-quantity batch production, and it possesses cost competitiveness through secured materials.
The 13th International LED & OLED EXPO is the largest exhibition that integrates lighting, equipment, components, and materials of LED and OLED. Two hundred forty companies from 13 different countries are running 550 booths.
Furthermore, it is expected to provide an opportunity for company officials and buyers to communicate with each other, and encourage the development of the domestic LED industry. A variety of events are on tap, including the 5th LED Industrial Forum, Export Counseling for invited foreign buyers, and High Technology Development Companies Government Award Ceremony.
